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DASIP 2010
Conference on Design & Architectures for Signal & Image Processing

November 26-28, 2010
Edinburgh, Scotland

The historical city of Edinburgh, the capital of Scotland and home to some half a million people, will host the 2010 Conference on Design and Architectures for Signal and Image Processing (DASIP) from the 26th to the 28th of October 2010. DASIP provides an inspiring international forum for latest innovations and developments in the field of leading edge embedded signal processing systems. Prospective authors are invited to submit manuscripts on topics including, but not limited to:
Design methods and tools
  • Design verification and fault tolerance
  • Embedded system security and security validation
  • System-level design and hardware/software co-design
  • Communication synthesis, architectural and logic synthesis
  • Embedded real-time systems and real-time operating systems
  • Rapid system prototyping, performance analysis and estimation
  • Formal models, transformations, algorithm transformations and metrics

Development platforms, architectures and technologies

  • Embedded platforms for multimedia and telecom
  • Many-core and multi-processor systems, SoCs, and NoCs
  • Reconfigurable ASIPs, FPGAs, and dynamically reconfigurable systems
  • Asynchronous (self-timed) circuits and analog and mixed-signal circuits
  • Digital biosignal processing, biologically based and/or inspired systems

Use-cases and applications

  • Ambient intelligence, ubiquitous and wearable computing
  • Global navigation satellite systems, smart cameras, and PDAs
  • Security systems, cryptography, object recognition and tracking
  • Embedded systems for automotive, aerospace, and health applications

Smart sensing systems

  • Sensor networks, environmental and system monitoring
  • Vision, audio, fingerprint, health monitoring, and biosensors
  • Structurally-embedded, distributed, and multiplexed sensors
  • Sensing for active control systems, adaptive and evolutionary sensors

The conference program will include keynote speeches, contributed paper sessions, and demonstrations. Special sessions, may be on the topics of:

  • Reliable multi-processor scheduling and  HW/SW resource management
  • Reconfigurable (computing) architectures
  • The open computing language (OpenCL)
  • Reconfigurable video coding (RVC)
  • Smart image sensors

Authors should submit their full papers (up to 8 pages, double-column IEEE format) in PDF through the web based submission system. Proceedings of DASIP 2010 will be included in the IEEE Xplore Digital Library. Authors of the best papers will be invited to submit an extended version of their work to the International Journal of Embedded and Real-Time Communication Systems (IJERTCS), in which a special issue on DASIP will be published on the third quarter of 2011.

Paper Submission May 15 
May 28 (extended)
Acceptance Notification July 15

General Chair:
Tughrul Arslan, University of Edinburgh, UK

Program Co-Chairs:
Tapani Ahonen, Tampere University of Technology, FI
Jean-François Nezan, Institut National des Sciences Appliquées Rennes, FR

Shuvra S. Bhattacharyya
Jarmo Takala
Emmanuel Boutillon

ABID Mohamed, Ecole nationale d'ingénieurs de Sfax, Tunisia
ERDOGAN Ahmet, University of Edinburgh, UK
GOGNIAT Guy, Université de Bretagne Sud, France
GRANADO Bertrand, Ecole Nationale Supérieure de l'Electronique et de ses Applications, France
LEGAT Jean-Didier, Université catholique de Louvain, Belgium
MANCINI Stéphane, Institut polytechnique de Grenoble, France
MATTAVELLI Marco, Ecole Polytechnique Fédérale de Lausanne, Switzerland
MILOJEVIC Dragomir, Université Libre de Bruxelles, Belgium
MORAWIEC Adam, European Electronic Chips & Systems design Initiative, France
PAINDAVOINE Michel, Université de Bourgogne, France

AL-AKAIDI Marwan, De Montfort University, Leicester, England
AMIRA Abbes, Brunel University, England
ARIDHI Slaheddine, Texas Instruments, France
ARSLAN Tughrul, University of Edinburgh, UK
BECKER Juergen, Karlsruhe University, Germany
BEREKOVIC Mladen, Technical University of Braunschweig, Germany
BOBDA Christophe, Universität Potsdam, Germany
BOURIDANE Ahmed, Queen's University Belfast, Ireland
BRUNELLI Claudio, Nokia Research Center, Finland
CABESTANY Joan, UPC - Technical University of Catalunya, Spain
CHILLET Daniel, ENSSAT, France
CRAWFORD David, Epson Scotland Design Centre, Scotland
DIGUET Jean-Philippe, Lab-STICC CNRS, France
DRUTAROVSKY Milos, Technical University of Kosice, Slovakia
ERDOGAN Ahmet T., University of Edinburgh, Scotland
FERRER Carles, Universitat Autònoma de Barcelona, Spain
GARDA Patrick, Université Pierre et Marie Curie, France
GARZIA Fabio, Tampere University of Technology, Finland
GOGNIAT Guy, Université de Bretagne Sud, France
GRANADO Bertrand, ETIS-ENSEA, France
HANNIG Frank, University of Erlangen-Nuremberg, Germany
HOWELLS W. Gareth J., University of Kent, England
HÜBNER Michael, Universität Karlsruhe, Germany
IBRAHIM Mohammad, Faculty of Technology, Leicester, UK
INDRUSIAK Leandro Soares, University of York, United Kingdom
KOCH Peter, CSDR, Denmark
LEGAT Jean-Didier, Université catholique de Louvain, Belgium
MAMALET Franck, France Télécom, France
MANCINI Stéphane, LIS, France
MANET Philippe, Université Catholique de Louvain, Belgium
MANSOUR Mohammad M., American University of Beirut, Beirut, Lebanon
MATTAVELLI Marco, EPFL, Switzerland
MCDONALD-Maier Klaus D., University of Essex, England
MEFTALI Samy, Université de Lille, France
MILOJEVIC Dragomir, ULB, Belgium
OGUNFUNMI Tokunbo, Santa Clara University, Santa Clara, CA
PAINDAVOINE Michel, Université de Bourgogne, France
PIGUET Christian, CSEM, Switzerland
ROBERT Frédéric, Université Libre de Bruxelles, Belgium
SHAILENDRA Baraniya. NMIMS University, INDIA
SHAWKY Mohamed M., Heudiasyc, France
SIGUENZA-TORTOSA David, Universidad Complutense de Madrid (UCM), Spain
SOREL Yves, INRIA, France
TAKALA Jarmo, Tampere University of Technology, Tampere, Finland
VANDERPERREN Yves, KU Leuven, Belgium
VLADIMIROVA Tanya, University of Surrey, England
WEBER Serge, Université Henri Poincaré, France

The University of Edinburgh/School of Engineering
ECSI Office
office [at] ecsi [dot] org
Ph: +33 4 76 63 49 34
Fax: +33 9 58 08 24 13


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